Kao Hsun Chang
President chez KING YUAN ELECTRONICS CO., LTD.
Fortune : 9 M $ au 30/04/2024
Profil
Kao Hsun Chang is currently the Chairman at KYEC Japan KK, Director at KYEC USA Corp., Director at KYEC Singapore Pte Ltd., Director at Zhen Kun Technology Co., Ltd., Director at Suzhou Zhen Kun Technology Ltd., General Manager at King Yuan Electronics Co., Ltd.
(starting in 2000), and Member-Supervisory Board at Jinglong Technology (Suzhou) Co. Ltd.
Mr. Chang previously worked as a Manager at Winbond Electronics Corp.
Mr. Chang holds an MBA from Saginaw Valley State University (Michigan) and an undergraduate degree from National Cheng Kung University.
Détentions connues dans des sociétés publiques
| Société | Date | Nombre d'actions | Valorisation | Date de valorisation |
|---|---|---|---|---|
| 31/01/2024 | 3 051 294 ( 0,25% ) | 9 M $ | 30/04/2024 |
Postes actifs de Kao Hsun Chang
| Sociétés | Poste | Début |
|---|---|---|
| KING YUAN ELECTRONICS CO., LTD. | President | 01/09/2023 |
| KYEC USA Corp. | Directeur/Membre du Conseil | - |
| KYEC Singapore Pte Ltd. | Directeur/Membre du Conseil | - |
| KYEC Japan KK | Président | - |
Jinglong Technology (Suzhou) Co. Ltd.
 Jinglong Technology (Suzhou) Co. Ltd. Miscellaneous Commercial ServicesCommercial Services Jinglong Technology (Suzhou) Co. Ltd. engages in the research and development, design, manufacturing, packaging, testing, processing, and repair of semiconductor integrated circuits. It specializes in semiconductor IC, transistors, electronic components, electronic materials, analog or hybrid automatic data processors, solid-state memory systems, heating ovens and related products and parts. The company was founded on September 30, 2002 and is headquartered in Suzhou, China. | Directeur/Membre du Conseil | - |
| Zhen Kun Technology Co., Ltd. | Directeur/Membre du Conseil | - |
Suzhou Zhen Kun Technology Ltd.
 Suzhou Zhen Kun Technology Ltd. Electronic ComponentsElectronic Technology Suzhou Zhen Kun Technology Ltd. provides packaging services for integrated circuit products. It engages in the processing and provision of semiconductor packaging for small outline packages (SOP), thin small outline packages (TSOP), complementary metal-oxide semiconductor sensors, quad flat no-lead packages, land grid arrays, single inline packages, ball grid arrays, and memory cards. The company was founded on December 8, 2005 and is headquartered in Suzhou, China. | Directeur/Membre du Conseil | - |
Anciens postes connus de Kao Hsun Chang
| Sociétés | Poste | Fin |
|---|---|---|
| WINBOND ELECTRONICS CORPORATION | Corporate Officer/Principal | - |
Formation de Kao Hsun Chang
| Saginaw Valley State University (Michigan) | Masters Business Admin |
| National Cheng Kung University | Undergraduate Degree |
Expériences
Fonctions occupées
Relations
Relations au 1er degré
Entreprises liées au 1er degré
Homme
Femme
Administrateurs
Exécutifs
Sociétés liées
| Sociétés cotées | 2 |
|---|---|
| WINBOND ELECTRONICS CORPORATION | Electronic Technology |
| KING YUAN ELECTRONICS CO., LTD. | Commercial Services |
| Entreprise privées | 6 |
|---|---|
| KYEC USA Corp. | |
Jinglong Technology (Suzhou) Co. Ltd.
Jinglong Technology (Suzhou) Co. Ltd. Miscellaneous Commercial ServicesCommercial Services Jinglong Technology (Suzhou) Co. Ltd. engages in the research and development, design, manufacturing, packaging, testing, processing, and repair of semiconductor integrated circuits. It specializes in semiconductor IC, transistors, electronic components, electronic materials, analog or hybrid automatic data processors, solid-state memory systems, heating ovens and related products and parts. The company was founded on September 30, 2002 and is headquartered in Suzhou, China. | Commercial Services |
| KYEC Japan KK | |
| KYEC Singapore Pte Ltd. | |
| Zhen Kun Technology Co., Ltd. | |
Suzhou Zhen Kun Technology Ltd.
Suzhou Zhen Kun Technology Ltd. Electronic ComponentsElectronic Technology Suzhou Zhen Kun Technology Ltd. provides packaging services for integrated circuit products. It engages in the processing and provision of semiconductor packaging for small outline packages (SOP), thin small outline packages (TSOP), complementary metal-oxide semiconductor sensors, quad flat no-lead packages, land grid arrays, single inline packages, ball grid arrays, and memory cards. The company was founded on December 8, 2005 and is headquartered in Suzhou, China. | Electronic Technology |